Eight Quality Requirements in the Production of Electronic Radiators

       1、 The surface of the heat dissipation body should be free of defects such as shrinkage, rust, and cracks;

       2、 The metal fasteners (pressure plate, gland, disc spring) of the flat heat sink and the conductive plate of the water-cooled heat sink should be protected with a coating;

       3、 The surface roughness Ra of the heat dissipation surface is very large, and the allowable value is 3.2, m;

       4、 The flatness of the heat dissipation surface should not be lower than level 9;

       5、 The surface of heat sinks (including heat sinks, fasteners, and insulation components) used for power semiconductor devices in humid tropics should be protected, and their resistance to moisture, salt spray, and mold should comply with the corresponding tropical power semiconductor device standards;

       6、 The fasteners and insulation parts for heat sinks should comply with GBB446.3 (Heat sink insulation parts and fasteners for power semiconductor devices)

       7、 The tightening torque or pressure for the installation of heat sinks and power semiconductors should comply with the relevant provisions of the device product standards;

       8、 The installation center positioning pin size of the flat heat dissipation body tabletop: 2.5mm in diameter, 1mm higher than the tabletop.

       These eight aspects are the accumulation and accumulation of experience, for reference only.